realme Book Prime adopts a new generation of VC liquid cooling technology, exclusive micron-level yellow photo-etched microstructure, and the comprehensive heat dissipation performance is 32.7% higher than that of the previous generation.
*The yellow photo etching process is an innovative process of chemical AG etching, which forms a specific texture pattern by changing the physical and chemical structure of the surface. This process can engrave a groove width of at least 10μm (generally 30μm in the industry) to form a denser capillary microstructure with stronger water absorption capacity, which can replace part of the copper mesh to form a microstructure + copper mesh composite structure. In the same heat dissipation, this microstructure VC vapor chamber can be thinner and has better heat dissipation performance.
